Vertiv, a leader in digital infrastructure solutions, has expanded its thermal management portfolio with the Vertiv™ CoolLoop Trim Cooler. This new solution supports air and liquid cooling for AI and high-performance computing [HPC] environments. It offers efficient cooling for hybrid-cooled and liquid-cooled data centers and AI factories worldwide.
Designed for high-density, liquid-cooled environments, the CoolLoop Trim Cooler enhances efficiency while reducing energy consumption by up to 70% and saving 40% more space compared to traditional systems. It supports water temperatures up to 40°C and cold plate cooling at 45°C, making it ideal for AI-driven infrastructure with fluctuating cooling demands.
AI is transforming data center cooling, requiring innovative solutions for high-power racks over 100kW
The system integrates seamlessly with Vertiv™ CoolChip CDU for direct-to-chip cooling and can also connect to immersion cooling systems, simplifying installation and operational complexity. This allows for cost and time savings while ensuring broad compatibility across high-density cooling setups.
“AI is transforming data center cooling, requiring innovative solutions for high-power racks over 100kW,” said Sam Bainborough, VP of Thermal Business EMEA at Vertiv. “The expansion of our thermal management portfolio delivers future-ready cooling to meet these evolving demands.”
The CoolLoop Trim Cooler features low-GWP refrigerant and provides scalable cooling up to 3 MW in an air-cooled setup. Designed for energy efficiency, it optimizes free cooling across various climate conditions, cutting electricity use and CO2 emissions. Additionally, it meets the 2027 EU F-GAS regulations, ensuring compliance without the need for expensive infrastructure upgrades.
This latest addition strengthens Vertiv’s commitment to sustainable, high-efficiency cooling solutions tailored for AI and HPC applications.
